Copper-based brazing filler alloy available in 1/2″ cubes and granular powder grades. Used for capillary-action brazing of close-fitting metal joints.
Aluminum-silicon brazing filler in powder and granular grades. Lower melting temperature than copper-based Holtite versions. Used for aluminum-to-aluminum brazing.
Copper-based solder filler with lower melting temperature than Holtite brazing alloys. Available in 40-120 mesh powder. Used where base metal strength must exceed joint strength.
