Product Overview
Holtite Brazing Alloy is a copper-based filler metal designed for brazing applications where the alloy is heated above its melting point and drawn into close-fitting joints by capillary action. The copper base provides good thermal and electrical conductivity in the finished joint, and the alloy is formulated to flow freely through tight clearances without flooding the joint interface. It is supplied in multiple particle size formats to suit different application methods and joint geometries. Holtite is used in the brazing of copper and copper alloy components, steel assemblies, and other metal combinations where a strong, conductive joint is required. Capillary brazing with this alloy produces joints that are typically stronger than softer solder joints and suitable for moderate service temperatures. Application methods include furnace brazing, torch brazing, and induction brazing depending on the form used. Forms: 1/2″ cubes for manual torch and furnace brazing, 20-40 mesh granular for controlled paste and preform applications, and 40-80 mesh granular for finer paste formulations and precision joint work.
