Waffle Form for Easy Portioning

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Melting Point (Solidus), °F: 1070 — 1317

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Density, lbs/in³: 0 — 1

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  • 5% Phosphor Tin Alloy
    Product Code: 7955

    5% Phosphor Tin Alloy

    Phosphor tin master alloy (95% Sn, 5% P) for suppressing dross formation in tin and tin solder melts. Waffle form.
    Lead-free
    Dross Suppressor Production Solder Bath Grade Reduces Metal Loss Solder Bath Treatment
    Solidus
    1,317°F (714°C)
    Liquidus
    1,542°F (839°C)
    Density
    0.28 lbs/in³ (7.75 g/cm³)
    Primary Elements
    P, Sn
    Nominal Composition
    5% P, 95% Sn
    Shapes
    Waffle
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  • 50/50 Silicon Aluminum
    Product Code: 1503

    50/50 Silicon Aluminum

    Al-Si master alloy (50% Al, 50% Si) for precise silicon additions to improve fluidity and reduce shrinkage in aluminum casting...
    Lead-free
    Bulk Silicon Addition Excellent Dissolution Fluidity Improvement Hot Tear Suppression
    Solidus
    1,070°F (577°C)
    Liquidus
    1,960°F (1,071°C)
    Density
    0.088 lbs/in³ (2.45 g/cm³)
    Primary Elements
    Al, Si
    Nominal Composition
    50% Al, 50% Si
    Shapes
    Granular, Lumps, Slabs, Waffle
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