High Surface Area

Filter By

Filters
Melting Point (Solidus), °F

Melting Point (Solidus), °F: 1984 — 1984

Density, lbs/in³

Density, lbs/in³: 0 — 1

Lead Free
  • There are no filter terms yet
  • There are no filter terms yet
See more See less
Custom Request
Can't find the right composition?
Get Expert Help

Sort By:

  • #250 Flake Copper
    Product Code: 4306A

    #250 Flake Copper

    High-purity flake copper powder with lamellar geometry. Used for conductive inks, EMI shielding, thermal spray coatings, and chemical vapor deposition...
    Lead-free
    Conductive Ink Formulation EMI Shielding High Surface Area Lamellar Flake Geometry
    Solidus
    1,984°F (1,084°C)
    Liquidus
    1,984°F (1,084°C)
    Density
    0.209 lbs/in³ (5.8 g/cm³)
    Primary Elements
    Cu
    Shapes
    Powder
  • #325 Granular Copper
    Product Code: 4307A

    #325 Granular Copper

    High-purity 325 mesh granular copper powder in standard packaging for powder metallurgy, friction materials, conductive inks, and industrial applications.
    325 Mesh Fine Powder Consistent Particle Distribution High Surface Area Production Supply Form
    Solidus
    1,984°F (1,084°C)
    Liquidus
    1,984°F (1,084°C)
    Primary Elements
    Cu

Showing all 2 results