Copper-Based Solder

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Melting Point (Solidus), °F: 1544 — 1544

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  • Holtite Fine Gray Solder
    Product Code: 4508

    Holtite Fine Gray Solder

    Copper-based solder filler with lower melting temperature than Holtite brazing alloys. Forms: 40-120 mesh powder. Used where base metal strength...
    Lower Melting Than Brazing Alloys Copper-Based Solder Paste-Grade Powder Base Metal Stronger Than Joint
    Solidus
    1,544°F (840°C)
    Liquidus
    1,598°F (870°C)
    Density
    0.287 lbs/in³ (8 g/cm³)
    Primary Elements
    Cu · Zn · Sn
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